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Electronics Packaging Technology Conference

Electronics Packaging Technology Conference: Pioneering Innovation in Electronics Packaging

The Electronics Packaging Technology Conference (EPTC) is a prestigious international event organized by the IEEE Indonesia Section, held at the Sands Expo and Convention Centre in Singapore. As a flagship conference of the IEEE Electronics Packaging Society (EPS) in the Asia-Pacific region, EPTC has a long-standing reputation since its inception in 1997 for advancing the state of electronics packaging technology. The conference is designed to bring together professionals, researchers, and industry leaders from Singapore, Indonesia, and beyond to share knowledge, foster collaboration, and showcase the latest technological advancements shaping the future of electronics packaging.

Advancing the Electronics Packaging Industry in Asia-Pacific

EPTC plays a crucial role in the electronics industry by focusing on the packaging sector—a vital aspect that ensures electronic devices are reliable, efficient, and cost-effective. The conference’s location at the Sands Expo and Convention Centre reflects its international stature and commitment to providing a high-quality platform for innovation and dialogue.

Key objectives of the conference include:

Presenting cutting-edge research and development in electronics packaging

Encouraging collaborative efforts between academia, industry, and government organizations

Highlighting emerging trends such as miniaturization, thermal management, and materials science

Offering a venue for networking and partnership building among regional and global players

With attendees primarily from Singapore and Indonesia, EPTC serves as a regional hub that strengthens the Asia-Pacific electronics packaging ecosystem.

A Rich Program Featuring Innovations and Industry Insights

Participants at EPTC can look forward to a comprehensive agenda that covers a broad spectrum of topics relevant to the electronics packaging field. The conference program blends technical presentations, panel discussions, and workshops led by renowned experts and industry pioneers.
Typical highlights of the program include:

Advances in substrate and interconnect technologies

Innovations in thermal management solutions

Research on packaging materials and processes

Strategies for reliability testing and quality assurance

Emerging trends in microelectronics and nanoelectronics packaging

These sessions provide attendees with invaluable insights into overcoming current challenges and capitalizing on future opportunities.

Networking and Collaboration Opportunities

One of the key strengths of the Electronics Packaging Technology Conference is its ability to foster meaningful interactions among participants. EPTC acts as a melting pot where engineers, scientists, manufacturers, and business leaders can connect to exchange ideas, discuss projects, and explore partnerships.
Networking opportunities include:

Exhibition booths showcasing the latest packaging solutions and tools

Meet-the-expert sessions offering personalized discussions with thought leaders

Social events and receptions facilitating informal conversations and relationship-building

Collaborative spaces for industry-academia partnerships

These interactions help accelerate innovation and contribute to the advancement of electronics packaging technology in the region.

EPTC: A Flagship IEEE Event with Global Impact

As the IEEE EPS flagship conference in Asia and the Pacific, EPTC holds a distinguished place in the global electronics packaging community. Its consistent focus on quality research, practical applications, and regional collaboration ensures it remains relevant and influential.

Why attend EPTC?

To stay ahead of technological trends and breakthroughs

To expand professional networks and explore new business opportunities

To learn from experts and gain exposure to real-world case studies

To contribute to discussions that shape industry standards and future developments

By participating in EPTC, attendees position themselves at the forefront of an industry critical to the modern electronics ecosystem.

Shaping the Future of Electronics Packaging at EPTC

The Electronics Packaging Technology Conference continues to be a pivotal event for anyone involved in the electronics packaging sector in Asia-Pacific and beyond. By facilitating knowledge exchange, highlighting innovations, and fostering collaboration, EPTC plays an essential role in advancing the industry’s capabilities and addressing evolving challenges.

For professionals dedicated to pushing the boundaries of electronics packaging, the IEEE Electronics Packaging Technology Conference is an unmissable event that promises learning, connection, and inspiration.

ASIA GREEN PACKAGING INNOVATION SUMMIT

包装废弃物管理已从一种趋势演变为亚洲各行业的关键战略重点。在新加坡举行的亚洲绿色包装创新峰会是一次关键活动，这些担忧汇聚成可行的战略和创新。在这里，来自该地区各地的利益相关者齐聚一堂，共同解决紧迫的问题，探索进展并描绘可持续包装的未来。

亚洲的消费者越来越多地优先考虑可持续的做法。他们需要能够最大限度地减少从生产到处置对环境影响的包装解决方案。了解这些消费者情绪对于旨在使其战略与市场预期保持一致的行业参与者至关重要。

尽管取得了进展，但亚洲各地在实现可持续包装方面仍然存在挑战。问题包括监管的复杂性、技术限制以及广泛采用环保材料的需求。这些挑战推动了峰会的讨论和解决方案。

峰会探讨了对包装可持续性至关重要的一系列话题。关键会议涵盖监管格局、市场趋势和可持续价值链。讨论还涵盖材料科学、封装技术、数字整合和实现零碳排放战略方面的进展。

20多位行业领袖分享了有关亚洲弹性、敏捷和可持续供应链的见解和案例研究。参与者有机会与领先企业建立联系，促进合作，推动包装实践的变革。

会议聚焦关键话题，例如：
-包装废物管理法规
-消费者对可持续包装的看法
-亚洲软包装市场的后疫情趋势-可持续发展的
生命周期方法
-促进可再生和负责任的包装采购
-绿色和可生物降解材料的进步

小组讨论探讨了塑料包装向循环经济的过渡，强调化妆品等行业的碳中和和和资源效率。这种整体方法旨在重新定义包装实践，使经济增长与环境责任保持一致。

亚洲绿色包装创新峰会不仅仅是一次会议，它是变革的催化剂。通过促进对话、分享最佳实践和促进技术进步，峰会使利益相关者能够引领迈向可持续的未来。我们共同推进包装研发，增强产品差异化，强化价值链，打造能引起亚洲及其他地区具有可持续发展意识的消费者共鸣的品牌。

加入我们在新加坡举行的变革性峰会，为亚洲更环保、更具弹性的包装行业铺平道路。让我们共同创新、协作，通过绿色包装解决方案塑造可持续发展的未来。