Electronics 中的 Singapore 事件

Electronics Packaging Technology Conference

Electronics Packaging Technology Conference: Pioneering Innovation in Electronics Packaging

The Electronics Packaging Technology Conference (EPTC) is a prestigious international event organized by the IEEE Indonesia Section, held at the Sands Expo and Convention Centre in Singapore. As a flagship conference of the IEEE Electronics Packaging Society (EPS) in the Asia-Pacific region, EPTC has a long-standing reputation since its inception in 1997 for advancing the state of electronics packaging technology. The conference is designed to bring together professionals, researchers, and industry leaders from Singapore, Indonesia, and beyond to share knowledge, foster collaboration, and showcase the latest technological advancements shaping the future of electronics packaging.

Advancing the Electronics Packaging Industry in Asia-Pacific

EPTC plays a crucial role in the electronics industry by focusing on the packaging sector—a vital aspect that ensures electronic devices are reliable, efficient, and cost-effective. The conference’s location at the Sands Expo and Convention Centre reflects its international stature and commitment to providing a high-quality platform for innovation and dialogue.

Key objectives of the conference include:

Presenting cutting-edge research and development in electronics packaging

Encouraging collaborative efforts between academia, industry, and government organizations

Highlighting emerging trends such as miniaturization, thermal management, and materials science

Offering a venue for networking and partnership building among regional and global players

With attendees primarily from Singapore and Indonesia, EPTC serves as a regional hub that strengthens the Asia-Pacific electronics packaging ecosystem.

A Rich Program Featuring Innovations and Industry Insights

Participants at EPTC can look forward to a comprehensive agenda that covers a broad spectrum of topics relevant to the electronics packaging field. The conference program blends technical presentations, panel discussions, and workshops led by renowned experts and industry pioneers.
Typical highlights of the program include:

Advances in substrate and interconnect technologies

Innovations in thermal management solutions

Research on packaging materials and processes

Strategies for reliability testing and quality assurance

Emerging trends in microelectronics and nanoelectronics packaging

These sessions provide attendees with invaluable insights into overcoming current challenges and capitalizing on future opportunities.

Networking and Collaboration Opportunities

One of the key strengths of the Electronics Packaging Technology Conference is its ability to foster meaningful interactions among participants. EPTC acts as a melting pot where engineers, scientists, manufacturers, and business leaders can connect to exchange ideas, discuss projects, and explore partnerships.
Networking opportunities include:

Exhibition booths showcasing the latest packaging solutions and tools

Meet-the-expert sessions offering personalized discussions with thought leaders

Social events and receptions facilitating informal conversations and relationship-building

Collaborative spaces for industry-academia partnerships

These interactions help accelerate innovation and contribute to the advancement of electronics packaging technology in the region.

EPTC: A Flagship IEEE Event with Global Impact

As the IEEE EPS flagship conference in Asia and the Pacific, EPTC holds a distinguished place in the global electronics packaging community. Its consistent focus on quality research, practical applications, and regional collaboration ensures it remains relevant and influential.

Why attend EPTC?

To stay ahead of technological trends and breakthroughs

To expand professional networks and explore new business opportunities

To learn from experts and gain exposure to real-world case studies

To contribute to discussions that shape industry standards and future developments

By participating in EPTC, attendees position themselves at the forefront of an industry critical to the modern electronics ecosystem.

Shaping the Future of Electronics Packaging at EPTC

The Electronics Packaging Technology Conference continues to be a pivotal event for anyone involved in the electronics packaging sector in Asia-Pacific and beyond. By facilitating knowledge exchange, highlighting innovations, and fostering collaboration, EPTC plays an essential role in advancing the industry’s capabilities and addressing evolving challenges.

For professionals dedicated to pushing the boundaries of electronics packaging, the IEEE Electronics Packaging Technology Conference is an unmissable event that promises learning, connection, and inspiration.

Semicon SouthEast Asia

SEMICON 东南亚：半导体创新的强国盛会

在不断变化的电子和微技术格局中，SEMICON 东南亚已成为反映半导体行业动态本质的重要国际平台。这个具有高影响力的贸易展览会交替在新加坡、马来西亚和其他主要区域中心举办，因其在塑造半导体、纳米电子和微技术未来中所起的作用而引起了全球的关注。

SEMICON东南亚由SEMI Global组织，SEMICON东南亚站在创新的最前沿，SEMICON是电子制造生态系统卓越的代名词。它不仅仅是技术展示——它是行业领导者、研究人员、工程师和企业高管的战略聚会，他们聚集在一起，探索、展示和交流有关半导体生产中最紧迫的问题和趋势的想法

区域技术进步的灯塔与许多通用技术

展览会不同，SEMICON东南亚对半导体价值链的关注更加敏锐。从硅晶圆到芯片封装，从软件平台到下一代材料，该活动反映了东南亚在全球高科技制造业中的地位不断提高。

东南亚地区，尤其是马来西亚和新加坡等国家，已成为全球电子制造供应链的重要组成部分，而SEMICON既是这种增长的庆祝活动，也是这种增长的催化剂。该博览会提供了一个无与伦比的机会，可以在一个综合空间中见证研究、投资和制造业的交汇点。SEMICON 东南亚

扩大视野：活动提供的内容 S

EMICON东南亚的范围远不止是展厅。它具有多层次的体验，包括会议、研讨会、现场演示、投资者计划和颁奖典礼，所有这些都旨在促进创新、投资和合作。

战略会议轨道和论坛

该活动举办了一系列高级别论坛和讨论，汇集了决策者、技术专家和市场分析师。

其中包括：半导体技术研讨会，业内资深人士和技术先驱在会上讨论半导体材料、器件架构和自动化系统的最新发展。

市场趋势论坛—提供有关区域增长预测，投资趋势以及地缘政治对全球芯片制造的影响的见解。

SEMI投资论坛—为企业家和初创企业提供了向投资者和企业合作伙伴推销其技术的难得机会。

核心技术和设备展示

SEMICON东南亚的与众不同之处在于其技术展品的深度，不仅涵盖最终用户产品，还涵盖半导体生产的每个阶段。访客可以亲身体验对该行业至关重要的高级工具、服务和组件。

主要特色领域包括：

光伏制造系统和材料

平板显示器制造工具

洁净室和真空技术

用于芯片设计和验证的软件平台

对生产线至关重要的子系统和零件

以下是通常代表的几个类别：核心产品类别：



晶圆处理系统

光刻和蚀刻设备

测试和计量工具

IC 封装解决方案

电路建模设计软件

原材料（气体、光刻胶等）

网络、协作和行业认可

博览会最重要的价值之一是其对社区建设的重视。该活动包括专门的供应商搜索计划、结构化的B2B会议和现场产品演示。这些举措是量身定制的，旨在促进协作、激发新的合作伙伴关系并加快产品开发流程。

除了商业上的成功外，SEMICON还将认可作为优先事项。SEMI大奖是对在

为什么 SEMICON 东南亚在全球范围内很

重要 SEMICON 东南亚的重要性远远超出了东道国的边界。随着半导体行业的地缘政治日趋紧张，人们对供应链、芯片主权和战略材料的担忧，像这样的区域中心变得越来越重要。
该地区的战略优势包括：具有成本效益的

熟练劳动力

政府支持的科技区和激励措施

在马来西亚、新加坡和越南建立的电子生态系统

强大的知识产权保护和强大的贸易基础设施

东南亚正在迅速将自己定位为制造中心，而且是面向未来的半导体技术的研发中心。像SEMICON这样的活动通过将所有行业利益相关者聚集在一个屋檐下，在培育这种演变方面发挥了

创新、教育和聚焦未来

SEMICON东南亚最独特的方面之一是其对未来人才和教育的关注。大学、工程机构和研究中心积极参与：

推动半导体生态系统向前发展

在半导体为电动汽车到医疗设备等一切提供动力的时代，像SEMICON东南亚这样的活动不仅仅是贸易展——它们是塑造全球技术未来的战略峰会。通过提供强大的网络、产品展示、教育和战略远见组合，SEMICON继续加强东南亚作为全球电子价值链基石的作用。

APE - ASIA PHOTONICS EXPO

亚洲光子学博览会（APE）是全球光子学日历上具有里程碑意义的盛会，以其在行业内促进品牌和业务联系的能力而闻名。作为光子学的领先平台，APE专注于亚洲的最新进展和新兴应用市场，为光子学领域的专业人士之间的深入交流与合作提供了全面的空间。

APE每年举办一次，其展览面积为15,000平方米，可容纳400多家参展商，吸引超过5,000名参观者。这个有影响力的活动是一个一站式平台，行业领导者可以在这里发现突破性技术，探索创新解决方案，并获得对市场趋势的宝贵见解。

APE 的范围涵盖了广泛的光子学应用，包括光通信、光学、半导体、激光、传感技术和显示系统。该博览会经过战略性设计，旨在展示最新的最先进的产品和技术，突出光子学创新的前沿。它提供了一个动态的环境，行业专业人士可以在整个光子学供应链中与全球同行建立联系。

对于希望在亚洲新兴市场扩大业务范围的企业，APE提供了无与伦比的机会。与该领域的主要参与者互动，促进新的业务关系和探索潜在的合作，使与会者和参展商都受益匪浅。对于那些寻求保持行业趋势领先地位并深入了解区域市场动态的人来说，该活动是一个理想的场所。

除展览外，APE还同时举办会议和活动，探讨学术、工业和应用前景。这些会议为与会者提供了最新的研究、技术进步和行业发展的全面概述。通过参与这些讨论，专业人员可以进一步增强他们在光子学领域的知识和战略定位。

亚洲光电博览会继续为该行业的卓越表现树立基准，推动亚洲及其他地区的业务增长和创新。对于那些参与光子学的人来说，APE 是参与尖端技术、建立有价值的联系以及为该领域的持续发展做出贡献的关键机会